Attachment for contacting a heat sink with an integrated circuit chip and use thereof
US5206792A · kind A · utility
32Cited by
3References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 4, 1991 |
| Grant date | Apr 27, 1993 |
| Priority date | — |
| Expiry date | Nov 4, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An attachment for removably thermally contacting a heat sink with an integrated circuit chip located on a chip carrier which in turn is located on an integrated circuit card or board containing a body portion for contacting the chip, flange members extending from the body portion. Each of the flange members contains a pad-like member located at the end for contacting with the card or board. A compliant portion is present that extends away from the body portion for contacting the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.