Thin interface pellicle for dense arrays of electrical interconnects
US5207585A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1990 |
| Grant date | May 4, 1993 |
| Priority date | — |
| Expiry date | Oct 31, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion thereon for penetrating the surface of the pad or bump to create sidewalls to provide a clean contact surface and the electrode has a recessed surface to limit the penetration of the raised portion. The electrodes may be affixed to a thin flexible membrane to permit each contact to have independent movement over a limited distance and of a limited rotation. The invention overcomes the problem of making easily breakable electrical interconnections to high density arrays of pads or bumps on integrated circuit structures for testing, burn-in or package interconnect and testing applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.