Aqueous synthetic resin formulations
US5208282A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 1991 |
| Grant date | May 4, 1993 |
| Priority date | — |
| Expiry date | May 13, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/25
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Aqueous synthetic resin formulations containing PA0 A) from 3 to 75% by weight of one or more synthetic resins, PA0 B) one or more organic compounds having two or more hydrazide groups, PA0 C) from 0 to 10% by weight, based on the synthetic resin A, of benzophenone or acetophenone or of one or more acetophenone or benzophenone derivatives which are not monoethylenically unsaturated or of a mixture of these active ingredients, PA0 D) effective amounts of emulsifiers or protective colloids or of a mixture of these active ingredients, PA0 E) not less than 5% by weight of water and PA0 F) from 0 to 85% by weight of finely divided fillers, with the proviso that the total amount of the monomers d polymerized in the one or more synthetic resins A and of component C is from 0.05 to 10% by weight, based on the one or more synthetic resins A, and the ratio of the number of moles of hydrazide groups of component B and the number of moles of the aldehyde and keto groups of the monomers c polymerized in the one or more synthetic resins A is from 0.01 to 2. These synthetic resin formulations are suitable for coating, adhesive bonding, sealing or impregnating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.