Multilayer wiring substrate and production thereof
US5208656A · kind A · utility
15Cited by
12References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1991 |
| Grant date | May 4, 1993 |
| Priority date | — |
| Expiry date | Mar 25, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.