Hydrophobic and/or abhesive materials, reactive diluents, and reactive plasticizers
US5210121A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 28, 1991 |
| Grant date | May 11, 1993 |
| Priority date | — |
| Expiry date | Oct 28, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F110/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of imparting hydrophobic or abhesive properties to a substrate. A composition including a compound selected from the group consisting of PA1 (a) a compound of the formula EQU R.sub.1 R.sub.2 C.dbd.CR.sub.3 R.sub.4 PA1 and an oligomer of polymer thereof; PA1 (b) a compound of the formula EQU --(CR.sub.1 R.sub.2 --CR.sub.3 R.sub.4).sub.n -- PA1 (c) a compound of the formula ##STR1## and an oligomer or polymer thereof wherein R.sub.1, R.sub.2 and R.sub.3 are independently CH.sub.3 or C.sub.2 H.sub.5 ; R.sub.4 is H, CH.sub.3 or C.sub.2 H.sub.5 ; A and B are independently H, CH.sub.3, C.sub.2 H.sub.5 or --(CR.sub.1 R.sub.2 --CR.sub.3 R.sub.4).sub.n --; and n is an integer between 1 and 20,000,000 is applied to the surface of the substrate. When the composition cures, the substrate possesses superior water-proof and release properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.