Method for embedding wires within a powder metal core and sensor assembly produced by such a method
US5210493A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1992 |
| Grant date | May 11, 1993 |
| Priority date | — |
| Expiry date | Feb 27, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49076
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor magnetoresistive sensor and a method for its assembly is specifically provided. The preferred assembly method of this invention is compatible with automated semiconductor chip placement and packaging technology, so as to alleviate the previous requirement that the semiconductor sensing element be separately packaged. The sensor leads are substantially embedded within a powdered metal permanent magnet body. An exposed terminal end of each lead is available for electrical and adhesive contact to a subsequently attached magnetoresistive semiconductor sensing element, using conventional semiconductor placement and packaging techniques. The powdered metal magnetic body is preferably formed by utilizing powder metal compaction techniques, wherein the powder metal is compacted around the interior electrical leads. The teachings of this invention may also be employed to form a variety of electrical sensors and devices, wherein the leads are substantially embedded within a metal core so as to produce a solid assembly. The embedded leads may have a variety of shapes, such as straight or coiled, may range in number from one to a plurality, and may have a variety of physical pr…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.