Soldering flux composition
US5211763A · kind A · utility
20Cited by
8References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Nov 29, 1991 |
| Grant date | May 18, 1993 |
| Priority date | — |
| Expiry date | Nov 29, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3613
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering flux composition comprising, as a flux base resin, a modified amine compound obtained by reacting (i) at least one member selected from the group consisting of vinyl group-containing compounds, carboxyl group-containing compounds and epoxy group-containing compounds (ii) with an amine compound having an active hydrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.