Electroplating means for perforated printed circuit boards to be treated in a horizontal pass

US5211826A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Daniel Hosten · Bochum, DE
• Josef Van Puymbroeck · Beernem, BE

Key dates

• Filing date: Sep 4, 1992
• Grant date: May 18, 1993
• Expiry date: Sep 4, 2012

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1509
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

An electroplating apparatus having a plurality of upper electrolyte feeder elements and upper electrolyte discharge elements aligned transversely relative to a throughput path of the printed circuit boards and arranged in alternation above the throughput path, a plurality of lower electrolyte feeder elements and lower electrolyte discharge elements aligned transversely relative to the throughput path and arranged in alternation under the throughput path, wherein each lower electrolyte discharge element is positioned opposite an upper electrolyte feeder element and each upper electrolyte discharge elements is positioned opposite a lower electrolyte feeder element, and wherein vertical and horizontal flow components of the electrolyte solution result and their direction alternatingly changes as seen along the throughput path of the printed circuit boards.