Thermosetting resin composition, and prepreg and laminated sheet which use the same
US5212244A · kind A · utility
4Cited by
2References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1991 |
| Grant date | May 18, 1993 |
| Priority date | — |
| Expiry date | Oct 8, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2351/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provide a thermosetting resin composition comprising PA0 (a) a poly-p-hydroxstyrene derivative represented by the general formula ##STR1## wherein A is a halogen group, R.sub.1 is an alkenyl or alkenoyl group of 2 to 4 carbon atoms, m denotes a number of 1 to 4 and from more than denotes a number of 1 to 100, PA0 (b) an epoxy-modified polybutadiene, and PA0 (c) an aromatic maleimide compound, and a prepreg and a laminated sheet which use said resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.