Bonding tool and its fabrication
US5213248A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 1992 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Jan 10, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H9/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The disclosure is directed to a bonding tool for use primarily in thermo-compression bonding of electronic circuit components and to a method of making the bonding tool. In one form of the disclosure, a holder is provided and has a substrate mounted at an end thereof. The holder is adapted to receive a heating element. A polycrystalline diamond film is disposed on the substrate, the film preferably being deposited by chemical vapor deposition. In a disclosed embodiment the substrate is a material selected from the group consisting of polycrystalline diamond, cemented tungsten carbide, silicon carbide, cubic boron nitride, and tungsten. In a further form of the disclosure, a ceramic substrate is provided which has a favorable thermal conductivity property as well as substantial electrical conductivity sufficient to permit shaping by electrical discharge machining ("EDM").
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.