Molding and gauging method
US5213726A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1991 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Jul 3, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2037/90
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding system including a mold and a molding machine has been adapted to monitor the position of mold element surfaces that move relative to each other to form a mold cavity. The system includes a source of gas under pressure and orifice-forming sensors on a first mold element to direct a flow of pressurized gas from the first mold element. A monitoring system monitors the condition of the gas remote from the first mold element to indicate the spacing between the first mold element and one or more adjacent mold elements as the mold elements move with respect to each other. The molding system can monitor the operation of large, complex die-casting molds that include a plurality of slides movable transversely to the movement of the molding machine and measures and indicates misalignment and warping of die elements, failure of the die elements to close and open properly, and other such irregularities in operation in the presence of the extremely high forces imposed upon the molds by the molding machine, high temperatures and hostile environment and to protect molds and molding machine parts from destructively high forces and to prevent or record manufacture of reject parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.