Thermally conductive interface materials and methods of using the same
US5213868A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1991 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Aug 13, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive interface material formed of a polymeric binder and one or more thermally fillers is disclosed. One or both of the major surfaces of the interface material has a means for removing air from between that surface and the surface to which it is attached, such as a heat sinker an electronic component. Alternatively, the heat sink or component may have the air removal means instead of or in addition to the interface material. The air removal means may be a series of embossments, channels or grooves or throughholes. Preferably, the interface is a pressure sensitive acrylic adhesive material and more preferably, it is in the form of a tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.