Thermoplastic resin composition
US5214091A · kind A · utility
36Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1992 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Mar 4, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/066
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed in this invention is a thermoplastic resin composition comprising a thermoplastic resin, a conductive inorganic filler and/or a non-conductive inorganic filler, and an adduct of an ethylene oxide with a saponified product of a copolymer of ethylene and a vinyl ester of a saturated carboxylic acid. The adduct of an alkylene oxide with a saponified product of a copolymer of ethylene and a vinyl ester of a carboxylic acid is an additive having excellent compatibility with the thermoplastic resin and useful for improving dispersibility of the inorganic filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.