Substrate for packaging a semiconductor device
US5214308A · kind A · utility
373Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1991 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Jan 23, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, and a recess for receiving at least a top of the bump is formed in the electrode terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.