Thermally conductive bar cooling arrangement for a transistor
US5214309A · kind A · utility
15Cited by
9References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 31, 1990 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Jan 31, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling structure for a high frequency power transistor is mounted on a circuit board where heat generated by the transistor is conducted from the semiconductor material through the collector conductor. A metal piece, which is larger than the collector conductor and sized to the requirements of heat removal through the collector conductor, contacts the collector conductor or an extension. The metal piece is solidly attached to a conductor strip formed on the circuit board. Heat is dissipated from the exposed surface of the metal piece to the ambient air and by conduction to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.