Compact memory module
US5214570A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1992 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Apr 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10515
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A memory module includes a mother board with an edge connector mounted adjacent one of its edges. Memory chips are mounted on the same side of the mother board as the edge connector. A daughter board, having memory chips mounted on its surface facing the mother board, is connected to the mother board so that its maximum height above the mother board is substantially no greater than that of the edge connector. Preferably the memory chips are mounted in thin TSOP packages and the daughter board is connected to the mother board by two rows of mating electrical pins and sockets, one located near the edge connector and the other near the top of the mother board, so the daughter board is mounted over virtually all of the width of the mother board except that covered by the edge connector, and so that the rows of mating connectors and the facing surfaces of the mother and daughter boards form an air channel through which air can flow to cool the memory chips mounted between the mother and daughter boards. In the preferred embodiment, each of the chip bearing surfaces of the mother and daughter boards has an equal number of chips, and has separate lines from the module's driver circuits, c…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.