Multilayer printed circuit and associated multilayer material
US5214571A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 1989 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Oct 16, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit, including: first and second layers, each comprising dielectric material, at least one of these layers having an opening therethrough for which the other layer does not have a corresponding opening therethrough, at least one of the layers bearing a conductive path; there being disposed between and bonded to these layers a third layer comprising substantially chemically nonpermeable material to chemically isolate the conductive path against subsequent treatment of the printed circuit; all three layers having corresponding datums formed thereon located for relative mutual alignment of the corresponding features on the layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.