Strain isolated integrated optic chip package
US5214726A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 7, 1991 |
| Grant date | May 25, 1993 |
| Priority date | — |
| Expiry date | Oct 7, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for an IOC fabricated from an anisotropic material, such as X-cut lithium niobate or lithium tantalate, having identical thermal expansion coefficients in the X and Y directions and a different thermal expansion in the Z direction, or for an IOC fabricated from an isotropic material, such as gallium arsenide or silicon, includes an IOC enclosure having a planar mounting surface which has identical thermal expansion coefficients in the X and Y directions. The coefficients of the planar mounting surface are relatively similar to the thermal expansion coefficients of a planar surface of the IOC. A planar surface of the IOC is attached to the planar mounting surface of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.