Rotating magnetron cathode and method for the use thereof
US5215638A · kind A · utility
18Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 1, 1991 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Nov 1, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Tubular target (1) has a magnet system (2) provided in the cavity (H) formed by the target (1) for the formation of a first plasma (6) for the coating of planar substrates (4) which are movable past the cathode (3), by means of a cathode sputtering process. A second plasma (9) is produced by a second magnet system (7) in the cavity (H) in an area between the cathode (3) and a plate (10) opposite the substrate (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.