Photosensitive resin composition and pattern formation using the same
US5215858A · kind A · utility
2Cited by
6References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 21, 1989 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Mar 21, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprising (A) an alkaline aqueous solution-soluble novolak resin, (B) a photosensitizer obtained by reacting a polyhydroxy compound with 1,2-naphthoquinone-(2)-diazido-5(or 4)-sulfonyl chloride, and (C) an ultraviolet absorber such as 2-(2'-hydroxy-5'-methylphenyl)-benzotriazole, has a strong absorption against a light of a wavelength of 365 nm and is suitable for producing semiconductor elements, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.