Resin composition and solder resist composition
US5215863A · kind A · utility
17Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 1991 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Oct 11, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein is a resin composition or a solder resist resin composition comprising an epoxy resin (A) and/or an epoxy acrylate (B) obtained by reacting one chemical equivalent of epoxy groups in an epoxy resin with 0.1 to 1.0 chemical equivalent of acrylic acid, a styrene-maleic anhydride copolymer (C), an unsaturated group-containing compound (D) other than (B), and a photopolymerization initiator (E).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.