Method of manufacturing a semiconductor device for optical pick-up
US5215928A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 26, 1992 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Aug 26, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/334
Abstract
Disclosed is a semiconductor device incorporating a plurality of photodiodes and comprising a prism on the device surface. A first and second optical film are deposited on the surface of a first photodiode. Furthermore, the first optical film is formed on the surface of a second photodiode, and the second optical film is provided at the periphery of the photodiode. This structure securely protects the pn junction of the second photodiode during manufacture. In addition, a light-shielding metal film formed at the periphery of the photodiodes has an insulation film deposited thereon, the insulation film containing very loss stress and providing high adhesiveness with respect to the prism. This arrangement enhances the reliability of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.