Devices comprised of discrete high-temperature superconductor chips disposed on a surface
US5215959A · kind A · utility
18Cited by
7References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 18, 1992 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | May 18, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/866
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A structure having a surface exposed to electromagnetic radiation in the microwave or millimeter-wave spectrum wherein discrete elements including a high-temperature superconducting film formed on a substrate are disposed on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.