Electronic module assembly and method of forming same
US5216581A · kind A · utility
25Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1992 |
| Grant date | Jun 1, 1993 |
| Priority date | — |
| Expiry date | Jul 16, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A one-piece electronic module assembly is formed from a substantially rectangular baseplate on which an insulating film is mounted to carry circuit components. An enclosed assembly is completed by initially providing a pair of major bend axes across the baseplate, and forming inwardly extending notches at selected locations along lengthwise edges of the baseplate. The baseplate is bent at the notches to form a front wall, a pair of sidewalls and tabs that overlap the sidewalls. The baseplate is then bent over on itself along the major bend axes and sealed, if necessary, to form a completed assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.