Polishing pad conditioning apparatus for wafer planarization process
US5216843A · kind A · utility
292Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1992 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Sep 24, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved apparatus for polishing a thin film formed on a semiconductor substrate includes a rotatable table covered with a polishing pad. The table and the pad are then rotated relative to the substrate which is pressed down against the pad surface during the polishing process. Means is provided for generating a plurality of grooves in the pad while substrates are being polished. The continually formed grooves help to facilitate the polishing process by channeling slurry between the substrate and the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.