Arrangement for the removal of an embedding body from the embedded component
US5217673A · kind A · utility
1Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Dec 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53683
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process and an arrangement are disclosed for the removal of a low-melting embedding body from a higher-melting embedded component. A groove is provided along a molding-in base of the component and by means of the widening of the groove via heatable elements, the resulting halves of the embedding body are removed. The process and the arrangement are particularly suitable for separating embedded guide and moving blades from the manufactured embedding body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.