Water sensitive hot melt adhesives for nonwoven applications
US5217798A · kind A · utility
71Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | May 7, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/693
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Nonwoven assemblies bonded with water dispersible or sensitive hot melt adhesives comprising 50-100 parts of a graft copolymer of about 40-85% of at least one vinyl monomer and about 15-60% of at least one water soluble polyalkylene oxide polymer, and about 0-50 parts by weight of tackifying resin. The compositions may also be employed as water sensitive binders in the manufacture of the nonwoven. Vinyl acetate is the preferred vinyl monomer whereas ethylene oxide homo- or copolymers are the preferred polyalkylene oxide. The use of tackifying resin is optional and may be undesirable for many of the applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.