Polyimide film with tin or tin salt incorporation resulting in improved adhesion
US5218034A · kind A · utility
15Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Aug 21, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide film having improved adhesion and thermal durability containing from 0.02 to 1% by weight of tin based on the weight of the film. A process for preparing a polyimide film is also described wherein a tin (II) or tin (IV) salt is introduced into a film-forming polyamide acid polymer prior to the casting step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.