Patent · US Expired

Polyoxymethylene molding materials having improved thermal stability and reduced formaldehyde emission

US5218041A · kind A · utility

4Cited by

5References

4Claims

0Family size

Assignee

Degussa AG · DE

Inventors

Detlef Arnoldi · Weisenheim am Berg, DE
Edwin Nun · Billerbeck, DE

Key dates

Filing date	Oct 7, 1991
Grant date	Jun 8, 1993
Priority date	—
Expiry date	Oct 7, 2011

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L61/28
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Polyoxymethylene molding materials having improved thermal stability and reduced formaldehyde emission consisting essentially of a polyoxymethylene as the main component and containing in addition, relative in each instance to the weight of the polyoxymethylene, 0.1 to 10% by weight of an endocopolymerizate, 0.05 to 3% by weight of a phenolic antioxidant, 0 to 5% by weight carbon black and 0 to 3% by weight of further additives customary in polyoxymethylene molding materials.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.