Epoxy adhesives and methods of using cured compositions therefrom
US5218063A · kind A · utility
17Cited by
8References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 26, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Jun 26, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/931
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy composition suitable for adhesives, coatings and sealants is prepared from (a) at least one reaction product of an epoxy and amine-capped oligomer, (b) an epoxy adduct of dimer acid, (c) dicyandiamide and (d) a catalyst which yields a dimethyl amine radical upon being heated. When the epoxy composition is cured, it exhibits two glass transition temperatures and good adhesion properties at and below room temperature. The epoxy is particularly suitable for adhesives used in the manufacturing of automobiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.