Semiconductor device having two-level wiring
US5218232A · kind A · utility
31Cited by
6References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | May 24, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor device, wherein an electrode wiring, which is in contact with semiconductor layers of mutually different conductive types and serves to connect at least the layers of mutually different conductive types, comprises a first portion principally composed of the same component as the principal component of the semiconductor layers, and a second portion consisting of a metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.