Patent · US Expired

Hermetically sealed waffle-wall configured assembly including sidewall and cover radiating elements and a base-sealed waveguide window

US5218373A · kind A · utility

32Cited by
8References
35Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 1, 1990
Grant dateJun 8, 1993
Priority date
Expiry dateOct 1, 2010

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01Q15/006
  • WIPO fieldTelecommunications
  • WIPO sectorElectrical engineering

Abstract

Directed millimeter wave radiation from internal elements of a microwave circuit through the housing cover, housing base, and side walls of a hermetically-sealed MMIC integrated subsystem assembly uses a waffle-wall array of conductive posts as a band rejection filter to provide walls which guide the radiated waves through a hermetically sealed window in the housing base for waveguide propagation or to a dielectric side wall or cover to radiate energy therethrough. For a waveguide launch, the launch probe is printed on a TEM mode microstrip transmission line substrate and is located over or on a dielectric window formed at the end of an air filled waveguide. A waveguide-like mode of propagation is launched perpendicular to the microstrip substrate and the energy is transmitted through the dielectric window into the air dielectric waveguide which extends through the housing base. Side wall mounted antennas use radiating elements placed near the side walls of the subsystem assembly and are surrounded on their remaining sides by the conductive post structure. The launched waves propagate toward the dielectric side wall to radiate outwardly from the subsystem assembly. For radiating en…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.