Electronic module
US5218516A · kind A · utility
50Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1991 |
| Grant date | Jun 8, 1993 |
| Priority date | — |
| Expiry date | Oct 31, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic module of printed circuit board with electronic components on one side and its other side in heat conducting contact with a heat sink enables the electronic components to be sealed from ambient atmosphere and thus unpackaged chips may be used. The modules are mountable in a support frame with air cooling passages of the heat sinks extending vertically for convected cooling air. In each module, a resistor network may extend into a cavity formed in a heat exchange rib and an electronic chip, perhaps unpackaged in the sealed environment, may be in heat conductive relationship with the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.