Lead conditioner for Quad semiconductor packages
US5219404A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 1991 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | May 20, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/024
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lead conditioning system (10) provides an offset conditioner (12), a planarity conditioner (14) and a tweeze conditioner station (16), a centering station (18), a transport assembly (20), a cabinet (22) having an input station (24) and an output station (26), and a control electronic control apparatus (28). Offset conditioner (12) conditions the offset spacing between leads of a gull-wing semiconductor device by shifting the leads axially in both directions and returning the leads to a center position according to a predetermined specification. Likewise, planarity conditioner station (14) deforms the leads of the semiconductor device so that the leads are essentially upright then repositions the leads by exerting forces downwardly on the tips of the leads so that the tips of the leads of the semiconductor device are essentially shifted to a coplanar position according to a predetermined specification. Offset conditioner (12) features a self-centering device with blades which accurately center the semiconductor device when the self-centering device is lowered thereover. Offset conditioner (12) also features a blade unit which is constructed with successive laminations of steel for…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.