Injection molding apparatus
US5219593A · kind A · utility
15Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1992 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | Jan 21, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2761
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Apparatus provides a large opening for rapid filling of a mold cavity and includes a heated injection nozzle adjacent the mold cavity, an elongated inlet conduit from the injection nozzle to the mold cavity, a channel in the heated injection nozzle communicating with the inlet conduit and cooling channels adjacent the inlet conduit to cool the inlet conduit operative to freeze resin in the inlet conduit after filling the mold cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.