Multi-layer photoresist air bridge fabrication method
US5219713A · kind A · utility
19Cited by
5References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1990 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | Dec 17, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of constructing an air bridge on a substrate between spaced apart conductors on the substrate with the bridge spanning the distance between the conductors, by using PMGI to build a bridge pad on the substrate; using PMMA to build a bridge pattern over the pad with the ends of said conductors extending into said pattern; depositing titanium and gold over said pad within said pattern by directing the titanium and gold into said pattern onto said pad and conductor ends using relative motion between the substrate and the titanium and gold; and removing the PMGI and PMMA.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.