Method of fabricating image sensor dies and the like for use in assembling arrays
US5219796A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1991 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | Nov 4, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/028
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays with minimal chipping and fracturing wherein the active side of a wafer is etched to form separation grooves with the wall of the grooves adjoining the die presenting a relatively wide surface to facilitate sawing, wide grooves are cut in the inactive side of the wafer opposite each separation grooves, and the wafer cut by sawing along the separation grooves, the saw being located so that the side of the saw blade facing the die is aligned with the midpoint of the wide wall so that on sawing the bottom half of the wall and the remainder of the grooves are obliterated leaving the top half of the wall to prevent cracking and chipping during sawing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.