Method for treating the surface of a thin porous film material
US5219894A · kind A · utility
2Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1992 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | Sep 28, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S521/918
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for treating the surface of a thin porous film material of tetrafluoroethylene resin is disclosed, which comprises heating said surface to a temperature higher than the thermal decomposition point of said resin so as to decompose and remove part of said surface. The resulting thin porous film material of tetrafluoroethylene resin has an adhesive surface while retaining the desired pore size, hardness, and degree of penetration of adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.