Injection molded printed circuits
US5220488A · kind A · utility
131Cited by
24References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 1992 |
| Grant date | Jun 15, 1993 |
| Priority date | — |
| Expiry date | Apr 27, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4916
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical circuit package wherein a flexible support member having conductive materials and electronic components thereon is fused with a substrate which acts as a support for the film. This results in a unitary packaged circuit. In one embodiment the film is a decal on which certain portions have a substrate fused thereto. In other embodiments, various layers of conductive materials are applied and molded into the substrate to form a variety of electronic functions. The circuit package lends itself to high production and reliability as well as cost savings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.