Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
US5221038A · kind A · utility
36Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1992 |
| Grant date | Jun 22, 1993 |
| Priority date | — |
| Expiry date | Oct 5, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder connection (30) is formed based upon a tinindium or tin-bismuth alloy, but having a melting temperature greater than the melting temperature of the initial solder alloy. A deposit (26) of solder alloy is placed against a tin plate (24) applied, preferably by electrodeposition, to a first faying surface (18). Following assembling with a second faying surface (22), the assembly is heated to melt the solder deposit, whereupon tin from the tin plate dissolves into the solder liquid to form a tin-enriched alloy having an increased melting temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.