Heat-conductive silicone oil compound
US5221339A · kind A · utility
12Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1990 |
| Grant date | Jun 22, 1993 |
| Priority date | — |
| Expiry date | Feb 6, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/34
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The silicone oil compound of the invention has a high thermal conductivity by virtue of compounding of a relatively large amount of a heat-conductivity improver such as zinc oxide, aluminum nitride and the like in a powdery form but still has an adequate and stable consistency suitable for application. This unique characteristic is obtained by the use of a specific silicone fluid as the base of the compound, which is a diorganopolysiloxane of which from 5 to 50% by moles of the silicon atoms at the molecular chain ends each have a hydroxy group bonded thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.