Process for making light emitting diodes
US5221641A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1992 |
| Grant date | Jun 22, 1993 |
| Priority date | — |
| Expiry date | May 27, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
Abstract
A process is provided for making light emitting diodes by using wire segments each plated with a glossy metal. The process comprises the steps of bending each wire segment generally into a U-shape to have a pair of legs connected together by an integral connecting web, deforming the free end of one leg by transverse compression to provide a cup end, mounting a semiconductor chip in the cup end, connecting the semiconductor chip to the free end of the other leg through a wire, forming a transparent or semitransparent resin package to enclose the respective free ends of the paired legs, and cutting the connecting web off the wire segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.