Lead frame for semiconductor device
US5221859A · kind A · utility
36Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1991 |
| Grant date | Jun 22, 1993 |
| Priority date | — |
| Expiry date | Feb 26, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3421
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame of a plastic encapsulated type semiconductor device is provided with a coating film which has a solderability higher than a solderability of a basic metal of the lead frame, and the coating film has a corrosion potential higher than a corrosion potential of the basic metal. The coating film protects the basic metal from corrosion caused by the plastic encapsulated member. The coating film of the lead frame made of a Fe-Ni alloy is an alloy comprising metal selected from Mo, W, Au, Cr, Cu, metals of the platinum group and a metal selected from Fe, Co, and Ni.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.