Patent · US Expired

Plant for the manufacture of printed-circuit boards or multi-layers

US5223037A · kind A · utility

3Cited by

4References

7Claims

0Family size

Assignee

Hans Hollmuller Maschinenbau GmbH & Co. · DE

Inventors

Niko Kraiss · Sindelfingen, DE
Rainer Haas · Herrenberg, DE
Werner Renz · Pforzheim, DE

Key dates

Filing date	Oct 23, 1990
Grant date	Jun 29, 1993
Priority date	—
Expiry date	Oct 23, 2010

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/122
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A plant for the manufacture of feedthrough (through-hole plated) printed-circuit boards or multilayers which comprises four modules (1, 11, 16, 21) through which the objects (3) to be treated are passed in a horizontal continuous process. In the first module (1) the surfaces to be coated are conditioned in an alkaline aqueous solution. An oxidative pre-treatment of the surfaces to be coated takes place in the second module (11). In the third module (16) a coating of organic monomers is deposited on the surfaces to be coated. Finally, in the fourth module (21) the deposited monomers are polymerized to form an electrically conductive coating. The printed-circuit boards or multilayers (3) thus treated and made electrically conductive on the lateral surfaces of the drill-holes are then passed on for the metallization of the lateral surfaces of the drill-holes (FIG. 1).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.