Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces
US5223116A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 11, 1992 |
| Grant date | Jun 29, 1993 |
| Priority date | — |
| Expiry date | May 11, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
For the electrophoretic application of a lacquer onto plate-shaped work pieces, the work pieces are conveyed on a horizontal throughput path through a cell wherein a lacquer deposition bath and at least one electrode are situated. The anodic or cathodic contacting of the traversing work pieces occurs via an endlessly circulating contacting drive preferably formed by a metal band and via a contact element arranged outside the cell for the feed of the anode current or cathode current to the contacting drive. The lacquer deposited on the contacting drive in the cell is in turn removed via a cleaning arrangement outside the cell and, thus, a reliable contacting of the work pieces is guaranteed. The apparatus is particularly suitable for the electrophoretic application of etching resists, plating resists and solder resists onto printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.