Patent · US Expired

Corrugated metal-clad sandwich panel with a wafer composite core

US5223326A · kind A · utility

4Cited by
5References
6Claims
0Family size

Assignee

Inventor

Key dates

Filing dateApr 23, 1991
Grant dateJun 29, 1993
Priority date
Expiry dateApr 23, 2011

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31989
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A corrugated metal-clad sandwich panel with a wafer composite core is provided. The single stage process for the panel manufacture involves utilizing a press platen system which is mechanically convertible between a planar and a corrugated configuration. The metal sheet is first placed on the lower platen which is in the planar configuration. The wafers and an isocyanate resin in admixture are uniformly distributed over the metal sheet. Optionally, a second metal sheet is placed over the wafer/resin mat. The platens are biased together to precompress the mat. Finally, the platens are converted from the planar to the corrugated configuration, thus forming the corrugated metal-clad sandwich panel having a waferboard core in a single stage.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.