Foldable electronic assembly module
US5224023A · kind A · utility
208Cited by
10References
11Claims
0Family size
Inventors
Key dates
| Filing date | Feb 10, 1992 |
| Grant date | Jun 29, 1993 |
| Priority date | — |
| Expiry date | Feb 10, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly combines a number of commensurate printed circuit boards bonded to a common, flexible, interconnecting substrate in an alternately folded and layered arrangement against an end board that has a comb of terminals for mounting into a motherboard connector. The flexible substrate is sandwiched between half-sections of each board, allowing mounting of components from both faces of the board. The assembly is particularly indicated for high density applications such as memory modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.