Method of using thermal energy absorbing and conducting potting materials
US5224356A · kind A · utility
44Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1991 |
| Grant date | Jul 6, 1993 |
| Priority date | — |
| Expiry date | Sep 30, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or as a mixture and may be employed as a powder or incorporated into a hardenable matrix such as an epoxy resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.