Apparatus for rapid plasma treatments and method
US5224441A · kind A · utility
139Cited by
21References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1991 |
| Grant date | Jul 6, 1993 |
| Priority date | — |
| Expiry date | Sep 27, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/473
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma treating apparatus is useful for coating substrates with thin films having vapor barrier properties at relatively rapid deposition rates. The apparatus comprises an evacuable chamber, an electrically powered electrode defining a plasma-facing surface within the chamber, and a shield spaced a distance .DELTA. transverse to the plasma-facing surface. During plasma treatments, the plasma is confined to within distance .DELTA. while a substrate is continuously fed through the confined plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.