Process for depositing optical films on both planar and non-planar substrates
US5225057A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1991 |
| Grant date | Jul 6, 1993 |
| Priority date | — |
| Expiry date | Nov 14, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/022
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A rotary cylindrical sputtering system incorporates separate, separately-controlled linear magnetron sputter deposition and reaction zones for sputter depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. In one aspect, the associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated deposition and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by the ability to form durable optical quality thin films of nominal refractive indices and controlled coating thickness, including both constant and selectively varied thickness profiles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.